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NXP |
MOSFET N-CH 30V 120A D2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 93.4nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 14500pF @ 25V
- Vgs (Max): ±10V
- FET Feature: -
- Power Dissipation (Max): 324W (Tc)
- Rds On (Max) @ Id, Vgs: 1.3 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: D2PAK
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
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Paket: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Lager2.320 |
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NXP |
TRANS RF NPN 12V 40MA SOT-143R
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 12V
- Frequency - Transition: 11GHz
- Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
- Gain: 16.5dB
- Power - Max: 450mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
- Current - Collector (Ic) (Max): 40mA
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SOT-143R
- Supplier Device Package: SOT-143R
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Paket: SOT-143R |
Lager5.728 |
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NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 7.5V
- Tolerance: ±1%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 15 Ohms
- Current - Reverse Leakage @ Vr: 700nA @ 5V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager2.048 |
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NXP |
DIODE ZENER 8.2V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 8.2V
- Tolerance: ±2%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 700nA @ 5V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager5.984 |
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NXP |
IC 10BIT TRANSP LATCH 24SOIC
- Logic Type: D-Type Transparent Latch
- Circuit: 10:10
- Output Type: Tri-State
- Voltage - Supply: 2.7 V ~ 3.6 V
- Independent Circuits: 1
- Delay Time - Propagation: 1.5ns
- Current - Output High, Low: 24mA, 24mA
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
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Paket: 24-SOIC (0.295", 7.50mm Width) |
Lager5.120 |
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NXP |
IC D-TYPE POS TRG SNGL 16SSOP
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 6
- Clock Frequency: 100MHz
- Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Iq): 160µA
- Input Capacitance: 3.5pF
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
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Paket: 16-SSOP (0.209", 5.30mm Width) |
Lager7.248 |
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NXP |
IC BUFFER/DVR 3-ST OCT 20TSSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Paket: 20-TSSOP (0.173", 4.40mm Width) |
Lager2.848 |
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NXP |
IC AMP AUDIO PWR 70W MONO 17SIL
- Type: Class B, Class H
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 70W x 1 @ 4 Ohm
- Voltage - Supply: 8 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -
- Supplier Device Package: DBS17P
- Package / Case: 17-SIP Formed Leads
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Paket: 17-SIP Formed Leads |
Lager6.624 |
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NXP |
IC SPI GPI 16-BIT 24-SOIC
- Number of I/O: 16 (Input Only)
- Interface: SPI Serial
- Interrupt Output: Yes
- Features: -
- Output Type: Push-Pull
- Current - Output Source/Sink: -
- Clock Frequency: 5MHz
- Voltage - Supply: 2.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
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Paket: 24-SOIC (0.295", 7.50mm Width) |
Lager3.280 |
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NXP |
IC MPU MPC82XX 300MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Paket: 480-LBGA |
Lager4.832 |
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NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 561-FBGA
- Supplier Device Package: 561-TEPBGA1 (23x23)
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Paket: 561-FBGA |
Lager5.808 |
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NXP |
IC MPU I.MX53 800MHZ 529TEBGA-2
- Core Processor: ARM? Cortex?-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, DDR2, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: SATA 1.5Gbps (1)
- USB: USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 529-FBGA
- Supplier Device Package: 529-TEPBGA-2 (19x19)
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Paket: 529-FBGA |
Lager2.272 |
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NXP |
IC MPU MPC83XX 133MHZ 369BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 369-LFBGA
- Supplier Device Package: 369-PBGA (19x19)
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Paket: 369-LFBGA |
Lager4.112 |
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NXP |
IC MCU 32BIT 256KB FLASH 81BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 81-LBGA
- Supplier Device Package: 81-MAPBGA (10x10)
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Paket: 81-LBGA |
Lager4.992 |
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NXP |
IC MCU 8BIT 128KB FLASH 80LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 69
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (14x14)
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Paket: 80-LQFP |
Lager2.320 |
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NXP |
IC MCU 8BIT 8KB FLASH 28PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
- Number of I/O: 26
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x8b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-LCC (J-Lead)
- Supplier Device Package: 28-PLCC (11.51x11.51)
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Paket: 28-LCC (J-Lead) |
Lager4.720 |
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NXP |
IC MCU 16BIT 256KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 14K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paket: 144-LQFP |
Lager4.000 |
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NXP |
IC MCU 32BIT 512KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 102
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 46x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paket: 144-LQFP |
Lager5.392 |
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NXP |
IC MCU 8BIT 7.5KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 21
- Program Memory Size: 7.5KB (7.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 384 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Paket: 32-LQFP |
Lager6.336 |
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NXP |
IC TRPL SWITCH MCU/LIN 54-SOIC
- Applications: Automotive Mirror Control
- Core Processor: HC08
- Program Memory Type: FLASH (16 kB)
- Controller Series: 908E
- RAM Size: 512 x 8
- Interface: SCI, SPI
- Number of I/O: 16
- Voltage - Supply: 5.5 V ~ 18 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 54-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 54-SOIC
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Paket: 54-BSSOP (0.295", 7.50mm Width) |
Lager6.496 |
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NXP |
IC CLK BUF DDR 190MHZ 1CIRC
- PLL: Yes
- Main Purpose: Memory, DDR, SDRAM
- Input: SSTL-2
- Output: SSTL-2
- Number of Circuits: 1
- Ratio - Input:Output: 1:10
- Differential - Input:Output: Yes/Yes
- Frequency - Max: 190MHz
- Voltage - Supply: 2.3 V ~ 2.7 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFBGA
- Supplier Device Package: 56-VFBGA (4.5x7)
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Paket: 56-VFBGA |
Lager2.256 |
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NXP |
ACCELEROMETER 16QFN
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN-EP (6x6)
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Paket: 16-QFN Exposed Pad |
Lager6.138 |
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NXP |
S32K144 100 MAPBGA
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Paket: 100-LBGA |
Lager3.200 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 16
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: SCI, SPI
- Peripherals: DMA, POR, WDT
- Number of I/O: 31
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP-EP (10x10)
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Paket: 64-LQFP Exposed Pad |
Lager6.368 |
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NXP |
IC TRANSCEIVER FULL 4/4 24DHVQFN
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 4/4
- Duplex: Full
- Receiver Hysteresis: -
- Data Rate: 20kbps
- Voltage - Supply: 5V ~ 28V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-DHVQFN (3.5x5.5)
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Paket: 24-VFQFN Exposed Pad |
Lager3.760 |
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NXP |
IC MPU QORIQ LAYER 1GHZ 448FBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 1 Core, 64-Bit
- Speed: 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 1Gbps (1), 2.5Gbps (5)
- SATA: SATA 6Gbps (1)
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 448-BFBGA
- Supplier Device Package: 448-FBGA (17x17)
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Paket: - |
Request a Quote |
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NXP |
LOW POWER CLASS D AMP
- Type: -
- Output Type: -
- Max Output Power x Channels @ Load: -
- Voltage - Supply: -
- Features: -
- Mounting Type: -
- Operating Temperature: -
- Supplier Device Package: -
- Package / Case: -
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Paket: - |
Request a Quote |
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NXP |
GATE DRIVERS HV ISOLATED GATE DR
- Driven Configuration: Half-Bridge
- Channel Type: Single
- Number of Drivers: 1
- Gate Type: IGBT, N-Channel MOSFET
- Voltage - Supply: 5V
- Logic Voltage - VIL, VIH: -
- Current - Peak Output (Source, Sink): 15A, 15A
- Input Type: -
- High Side Voltage - Max (Bootstrap): -
- Rise / Fall Time (Typ): -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 32-SOIC
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Paket: - |
Request a Quote |
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