NXP Produkte

PMV185XN,215

NXP

MOSFET N-CH 30V 1.1A TO-236AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 1.1A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
• Vgs(th) (Max) @ Id: 1.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 76pF @ 15V
• Vgs (Max): ±12V
• FET Feature: -
• Power Dissipation (Max): 325mW (Ta), 1.275W (Tc)
• Rds On (Max) @ Id, Vgs: 250 mOhm @ 1.1A, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: TO-236AB (SOT23)
• Package / Case: TO-236-3, SC-59, SOT-23-3

Paket: TO-236-3, SC-59, SOT-23-3

A2T20H160W04NR3

NXP

RF TRANS 2.0GHZ 160W OM780-4L

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

LD6836TD/18H,125

NXP

IC REG LINEAR 1.8V 300MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.2V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

Paket: SC-74A, SOT-753

MC34845BEP

NXP

IC LED DRVR RGLTR DIM 2.6A 24QFN

• Type: DC DC Regulator
• Topology: Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 6
• Voltage - Supply (Min): 5V
• Voltage - Supply (Max): 21V
• Voltage - Output: 8 V ~ 60 V
• Current - Output / Channel: 2.6A (Switch)
• Frequency: 300kHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-UFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

Paket: 24-UFQFN Exposed Pad

74HCT173N,652

NXP

IC D-TYPE POS TRG QUAD 16DIP

• Function: Master Reset
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 4
• Clock Frequency: 80MHz
• Max Propagation Delay @ V, Max CL: 40ns @ 4.5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 4µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)

Paket: 16-DIP (0.300", 7.62mm)

TDA8543T/N1,518

NXP

IC AMP AUDIO PWR 2.2W AB 16SOIC

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 2.2W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 16-SO
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

Paket: 16-SOIC (0.154", 3.90mm Width)

PCA9508D,112

NXP

IC REDRIVER I2C HOTSWAP 1CH 8SO

• Type: Buffer, ReDriver
• Applications: I2C - Hotswap
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 5.2pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 1mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Paket: 8-SOIC (0.154", 3.90mm Width)

PCA9617ADPJ

NXP

IC REDRIVER I2C 1CH 1MHZ 8TSSOP

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 1MHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 10pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 8µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

PCA9673PW,118

NXP

IC I/O EXPANDER I2C 16B 24TSSOP

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

Paket: 24-TSSOP (0.173", 4.40mm Width)

MPC8347ECVVAGDB

NXP

IC MPU MPC83XX 400MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Paket: 672-LBGA

MPC8349EZUALFB

NXP

IC MPU MPC83XX 667MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Paket: 672-LBGA

MPC8321CVRAFDCA

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

Paket: 516-BBGA

PK20FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 45x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

MC9S08DZ48CLH

NXP

IC MCU 8BIT 48KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 3K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: 64-LQFP

MC68334GFC16

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: -
• Number of I/O: 47
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

Paket: 132-BQFP Bumpered

S9S08SG32E1WTL

NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

Paket: 28-TSSOP (0.173", 4.40mm Width)

PCK946BD,128

NXP

IC CLK BUFFER 2:10 150MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Divider, Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:10
• Differential - Input:Output: No/No
• Input: LVCMOS, LVTTL
• Output: CMOS
• Frequency - Max: 150MHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: 32-LQFP

SA56004HDP,118

NXP

SENSOR TEMP I2C/SMBUS 8TSSOP

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MPX4250D

NXP

SENSOR DIFF PRESS 36.3PSI MAX

• Pressure Type: Differential
• Operating Pressure: 36.26 PSI (250 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.9 V
• Accuracy: ±1.4%
• Voltage - Supply: 4.85 V ~ 5.35 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 145.04 PSI (1000 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

Paket: 6-SIP Module

MMA5106NDIKGCWR2

NXP

ACCELEROMETER DSI2.5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

A7102CHTK2/T0BC2CJ

NXP

SECURITY IC EXT TEMP HVSON8

• Applications: Authentication
• Core Processor: MX51
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: I²C
• Number of I/O: -
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 90°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (4x4)

Paket: 8-VDFN Exposed Pad

MC34PF1550A7EP

NXP

PF1550

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

Paket: 40-VFQFN Exposed Pad

ASL2417SHNY

NXP

ENHANCED TWO CHANNEL LED BUCK DR

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

S9S12VR64AAVLC

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 2x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: -

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SAF775CHN-N208W-DK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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FG32K146HAT0MLHT

NXP

IC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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MPF7100BVMA2ESR2

NXP

POWER MANAGEMENT IC, I.MX 8XL WI

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

Paket: -

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LPC55S26JBD64E

NXP

IC MCU 32BIT 256KB FLASH 64TQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 36
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 144K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

Paket: -

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