Xilinx Inc. Produkte

XCCACE-TQG144I

Xilinx Inc.

IC ACE CONTROLLER CHIP 144TQFP

• Controller Type: CompactFlash
• Voltage - Supply: 2.25 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

XC17S30VO8I

Xilinx Inc.

IC PROM SER 300K 8-SOIC

• Programmable Type: OTP
• Memory Size: 300kb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

Paket: 8-SOIC (0.154", 3.90mm Width)

XCZU19EG-3FFVB1517E

Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paket: 1517-BBGA, FCBGA

XCZU19EG-1FFVE1924I

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XC7Z015-2CLG485I

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 485BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 766MHz
• Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-LFBGA, CSPBGA
• Supplier Device Package: 485-CSBGA (19x19)

Paket: 484-LFBGA, CSPBGA

XC7Z007S-1CLG225I

Xilinx Inc.

IC FPGA SOC 100I/O 225BGA

• Architecture: MCU, FPGA
• Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Artix?-7 FPGA, 23K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

Paket: 225-LFBGA, CSPBGA

XC3S1400AN-5FG484C

Xilinx Inc.

IC FPGA 372 I/O 484FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 372
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BBGA

XC6SLX150T-N3FGG900C

Xilinx Inc.

IC FPGA 540 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 540
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

Paket: 900-BBGA

XCV2000E-6FG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

• Number of LABs/CLBs: 9600
• Number of Logic Elements/Cells: 43200
• Total RAM Bits: 655360
• Number of I/O: 804
• Number of Gates: 2541952
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

Paket: 1156-BBGA

XC4010E-4HQ208C

Xilinx Inc.

IC FPGA 160 I/O 208HQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 160
• Number of Gates: 10000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

Paket: 208-BFQFP Exposed Pad

XC7V2000T-1FHG1761I

Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

• Number of LABs/CLBs: 152700
• Number of Logic Elements/Cells: 1954560
• Total RAM Bits: 47628288
• Number of I/O: 850
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1761-FCBGA (45x45)

Paket: 1760-BBGA, FCBGA

XC7VX1140T-1FLG1928C

Xilinx Inc.

IC FPGA 480 I/O 1928FCBGA

• Number of LABs/CLBs: 89000
• Number of Logic Elements/Cells: 1139200
• Total RAM Bits: 69304320
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1928-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XC6VHX380T-2FFG1923E

Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XC6VHX380T-2FF1155C

Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paket: 1156-BBGA, FCBGA

XC5VLX155T-1FFG1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

• Number of LABs/CLBs: 12160
• Number of Logic Elements/Cells: 155648
• Total RAM Bits: 7815168
• Number of I/O: 680
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

Paket: 1738-BBGA, FCBGA

XCKU035-2FBVA900I

Xilinx Inc.

IC FPGA 468 I/O 900FCBGA

• Number of LABs/CLBs: 25391
• Number of Logic Elements/Cells: 444343
• Total RAM Bits: 19456000
• Number of I/O: 468
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paket: 900-BBGA, FCBGA

XC4VFX60-10FFG672I

Xilinx Inc.

IC FPGA 352 I/O 672FCBGA

• Number of LABs/CLBs: 6320
• Number of Logic Elements/Cells: 56880
• Total RAM Bits: 4276224
• Number of I/O: 352
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

Paket: 672-BBGA, FCBGA

XCKU035-1SFVA784I

Xilinx Inc.

IC FPGA 468 I/O 784FCBGA

• Number of LABs/CLBs: 25391
• Number of Logic Elements/Cells: 444343
• Total RAM Bits: 19456000
• Number of I/O: 468
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCCSPBGA (23x23)

Paket: 784-BBGA, FCBGA

XC5VFX70T-1FFG1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 5600
• Number of Logic Elements/Cells: 71680
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

Paket: 1136-BBGA, FCBGA

XC6SLX150-L1FG484C

Xilinx Inc.

IC FPGA 338 I/O 484FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BBGA

XC7A15T-1CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

• Number of LABs/CLBs: 1300
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 921600
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

Paket: 324-LFBGA, CSPBGA

XC3S500E-4CP132I

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 92
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

Paket: 132-TFBGA, CSPBGA

XC6SLX16-N3CSG324I

Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 232
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

Paket: 324-LFBGA, CSPBGA

XC9536-7CS48C

Xilinx Inc.

IC CPLD 36MC 7.5NS 48CSP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

Paket: 48-FBGA, CSPBGA

XC9536XL-7VQ64I

Xilinx Inc.

IC CPLD 36MC 7.5NS 64VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-VQFP (10x10)

Paket: 64-TQFP

XC7S15-1FTGB196C

Xilinx Inc.

XC7S15-1FTGB196C

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 12800
• Total RAM Bits: 368640
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-LBGA, CSPBGA
• Supplier Device Package: 196-CSBGA (15x15)

Paket: 196-LBGA, CSPBGA

XC7S100-L1FGGA484I

Xilinx Inc.

XC7S100-L1FGGA484I

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 4423680
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

Paket: 484-BBGA, FCBGA

XC7S15-1CPGA196C

Xilinx Inc.

XC7S15-1CPGA196C

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 12800
• Total RAM Bits: 368640
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-TFBGA, CSBGA
• Supplier Device Package: 196-CSPBGA (8x8)

Paket: 196-TFBGA, CSBGA