Congatec announced the latest feature in its COM Express Basic portfolio: the new conga-TS97 computer module, manufactured in 14 nanometer technology, with an Intel Core or Intel Xeon processor (codename Broadwell).
The new Intel Xeon version of the conga-TS97 COM Express Basic module provides server-level performance for the first time. Compared with the previous version, it not only has excellent overall performance, but also has outstanding graphics technology due to the characteristic Intel Iris Pro. Intel's most powerful processor integrated graphics and media engine provides an immersive user experience with high frame rate fast 3D rendering and realistic shadows.
The new conga-TS97 high-end module is designed for any industry where applications with custom I / O and IoT interface configurations must meet the highest performance standards in the smallest space. Although Intel Core processor-based modules are well-suited for applications ranging from industrial automation to medical, retail, and gaming, Intel Xeon processor-based modules are designed for industry-standard server platforms.
Application areas include carrier-grade edge node servers and industrial cloud servers with high packaging density and / or minimal footprint. The high graphics performance of integrated IntelR IrisT Pro technology can be used for carrier-grade applications with real-time video transcoding and network function virtualization (NFV) content delivery platforms. It will also complete important situational awareness tasks in industrial applications. -Examples of self-driving cars. GPGPU-based applications can also be found in parallel deep packet inspection or content encryption and decryption. For server-based applications, the graphics engine provides distributed client-rich rich responsive 3D performance for CAD, 3D modeling, and video rendering.
Since the new processor is manufactured on the 14nm node of the new microarchitecture, performance upgrades can be implemented quickly and efficiently. The company said that existing product lines can be enhanced with new performance levels and optimized TDP, while providing evaluation boards immediately, which can accelerate the evaluation process for new applications.
