RECOM - Low profile DOSA converters offer excellent efficiency | Heisener Electronics
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RECOM - Low profile DOSA converters offer excellent efficiency

Technology Cover
Nach Datum: 2018-11-13
 RECOM's latest innovations increase the power density of DC-DC converters packaged with DOSA to a new level. RPM modules stand out with their outstanding efficiency of up to 99%, making thin packages ideal for space-critical applications. The new power module has a form factor of only 3.75mm, making it one of the highest power densities in the dosa footprint on the market. They offer 1A, 2A, 3A and even 6A scalability in the same size package. It is said that the power density of the 6A module is at least 50% higher than similar products due to the new IC and novel multilayer PCB layout. It is thermally optimized to remove heat from the circuit board, so it can provide more than 800W / in3 power at temperatures up to 90C without reducing power. Because the PCB's ground plane is used with a metal case, the six-sided shielding ensures excellent EMC performance. RPM power modules have been successfully designed, tested and manufactured in Europe. With the included input and output capacitors, the series can operate without additional components. They are SMDs with a ground grid array package.

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