THGBMJG6C1LBAIL Introduction
THGBMFG6C1LBAIL is an 8GB density e-MMC (embedded MultiMediaCard) module, housed in a compact 153-ball BGA (Ball Grid Array) package. This module utilizes advanced Toshiba NAND flash memory and a dedicated controller chip, which are integrated into a Multi Chip Module (MCM) design. The THGBMFG6C1LBAIL follows the industry-standard MMC protocol. It offers high data storage capacity, fast read/write speeds, and improved durability, making it suitable for applications that require reliable and efficient memory solutions.
THGBMJG6C1LBAIL Pinout
Power Supply Pins:
VCC: Power supply for the chip.
VSS: Ground reference.
Data Pins:
D0 to D3: Data lines for data transfer (4-bit data bus).
D4 to D7: Additional data lines (if applicable for specific configurations).
Command and Control Pins:
CMD: Command line for sending commands to the e-MMC.
CLK: Clock signal for synchronizing data transfer.
Other Pins:
RST_n: Reset pin to initialize the device.
BUSY: Indicates the status of the device (busy or ready).
Chip Select/Enable Pins (if applicable).
THGBMJG6C1LBAIL Footprint
THGBMJG6C1LBAIL 3D Model
THGBMJG6C1LBAIL Block Diagram
THGBMJG6C1LBAIL Specification
| Specification | Details |
| Density | 8 GB |
| Package Type | 153-WFBGA |
| Memory Size | 64Gbit |
| NAND Flash Type | TOSHIBA NAND Flash |
| Memory Organization | 8G x 8 |
| Supply Voltage (VCC) | 2.7V ~ 3.6V |
| Memory Interface | eMMC |
| Protocol | Industry-standard MMC protocol |
| Operating Temperature | -25°C ~ 85°C |
| Read Speed | Up to 200 MB/s |
| Write Speed | Up to 50 MB/s |
THGBMJG6C1LBAIL Features
High Density
Advanced NAND Technology
Integrated Controller
MMC Protocol Support
High Data Transfer Rates
Wide Operating Temperature Range
Low Power Consumption
JEDEC/MMCA Version 5.1interface with 1-I/O, 4-I/O and 8-I/O
THGBMJG6C1LBAIL Applications
Mobile Devices
Automotive Systems
Consumer Electronics
Industrial Applications
Embedded Systems
Medical Devices
THGBMJG6C1LBAIL Package
THGBMJG6C1LBAIL features a 153-ball WFBGA (Wafer-Level Ball Grid Array) package, designed for high-density applications that significantly enhance the integration of electronic components. Each ball-shaped pin is arranged in a specific configuration, making it suitable for environments where space is limited. Additionally, the ball grid array structure of the WFBGA package allows for quick soldering using standard surface mount technology (SMT), facilitating efficient large-scale production and assembly.
How to Use THGBMJG6C1LBAIL?
When using the THGBMJG6C1LBAIL, start by disconnecting the device's power supply. Next, align the THGBMJG6C1LBAIL module with the motherboard, ensuring that the pins are correctly aligned. After that, you can use a hot air gun or reflow soldering equipment to solder the module in place. Once the soldering is complete, allow the module to cool.
Next, reconnect the power supply and check the operational status of the THGBMJG6C1LBAIL. Use relevant testing tools, such as an oscilloscope or logic analyzer, to monitor signal output and power voltage. Finally, configure the software according to your application needs, setting the relevant parameters to fully leverage the performance of the THGBMJG6C1LBAIL.
FAQs
What is the role of the controller chip in THGBMJG6C1LBAIL?
The controller chip manages the interaction between the NAND flash memory and the host system, ensuring proper data management, wear leveling, and efficient communication.
How is THGBMJG6C1LBAIL programmed?
The module is programmed using standard e-MMC commands, which can be implemented through the host processor's interface, allowing easy integration into embedded systems.
What are the alternatives to THGBMJG6C1LBAIL?
Alternatives to the THGBMJG6C1LBAIL include other e-MMC modules like the Samsung KLM8G1GEMB-B041 and Micron MTFC8GAKAJCN-1M WT.
