Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SPEECH/VOICE INCA-S TQFP-144
|
Paket: 144-LQFP |
Lager3.392 |
|
IOM-2 | 1 | - | - | - | - | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Infineon Technologies |
IC LIU E1/T1/J1 256LBGA
|
Paket: 256-LBGA |
Lager2.752 |
|
E1, J1, T1 | 8 | 1.8V, 3.3V | 370mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA | PG-LBGA-256 |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager4.416 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC LINE INTERFACE 5V T1/J1 PLCC
|
Paket: 28-LCC (J-Lead) |
Lager2.368 |
|
LIU | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
Paket: 28-SOIC (0.295", 7.50mm Width) |
Lager5.824 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
NXP |
IC TRANSMISSION CIRCUIT 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager41.700 |
|
- | 1 | 3.4V | 900µA | 454mW | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
Paket: 16-VDFN Exposed Pad |
Lager3.696 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-DIP
|
Paket: 16-DIP (0.300", 7.62mm) |
Lager16.860 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Inphi Corporation |
IC EPON OLT 10GBPS COMM 854HSBGA
|
Paket: 854-BGA |
Lager5.280 |
|
XAUI | - | - | - | - | - | Surface Mount | 854-BGA | 854-BGA |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
Paket: 144-LQFP |
Lager4.272 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
Paket: 32-LCC (J-Lead) |
Lager17.292 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
Paket: 64-QFN |
Lager6.780 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | 64-QFN | 64-QFN |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
Paket: 42-WFQFN Exposed Pad |
Lager7.616 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
Paket: 42-WFQFN Exposed Pad |
Lager16.764 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
Paket: 38-VFQFN Exposed Pad |
Lager4.176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 44-TQFP
|
Paket: 44-TQFP |
Lager26.856 |
|
- | 1 | 3.135 V ~ 3.465 V | 66mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
Paket: - |
Lager4.992 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
Paket: - |
Lager6.304 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microsemi Corporation |
WSE-40 (PB FREE)
|
Paket: 672-BGA, FCBGA |
Lager5.280 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
||
Microchip Technology |
2P, DUAL-MEDIA, GE PHY, MACSEC 2
|
Paket: - |
Lager5.760 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paket: - |
Lager3.200 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paket: - |
Lager3.168 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Paket: 80-LQFP |
Lager4.672 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
Paket: 48-BSSOP (0.295", 7.50mm Width) |
Lager2.944 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
Paket: - |
Lager4.576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
Paket: 324-BGA |
Lager2.192 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
2CH VDSL CO CLASS H LD
|
Paket: 32-QFN |
Lager16.596 |
|
- | 2 | - | - | - | - | Surface Mount | 32-QFN | 32-QFN (5x5) |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL GW, NO S
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
TWIN SUBSCRIBER LINE INTERFACE
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |