Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE UNIT MQFP-44
|
Paket: 44-QFP |
Lager4.448 |
|
DS3, E3, STS-1 | 1 | 3.13 V ~ 3.46 V | 110mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | P-MQFP-44 |
||
Silicon Labs |
IC PROSLIC LINE FEED 135V 40QFN
|
Paket: 40-VFQFN Exposed Pad |
Lager5.360 |
|
PCM | 2 | - | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Silicon Labs |
IC PROSLIC LINE FEED 125V 40QFN
|
Paket: 40-VFQFN Exposed Pad |
Lager101.868 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
Paket: 217-BBGA |
Lager9.240 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
Paket: 217-BBGA |
Lager4.224 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
Paket: 256-LBGA Exposed Pad |
Lager5.680 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Microchip Technology |
IC UNVRSL PHONE CIRCUIT 44SSOP
|
Paket: 44-SOP (0.291", 7.40mm Width) |
Lager176.520 |
|
- | 1 | - | 3.8mA | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
Paket: 16-SOIC (0.295", 7.50mm Width) |
Lager7.376 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 20SOIC
|
Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager2.384 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Intersil |
IC RSLIC FAMILY 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager7.056 |
|
2-Wire | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
Paket: 28-SOIC (0.295", 7.50mm Width) |
Lager5.360 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC 1FXO CHIPSET 1CH OLAC 10MSOP
|
Paket: - |
Lager2.672 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
Paket: 8-SMD (0.300", 7.62mm) |
Lager3.488 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD (0.300", 7.62mm) | 8-SMD |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager44.400 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 100-LQFP
|
Paket: 100-LQFP |
Lager3.984 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC SIGNAL COND 4X4 69-BGA
|
Paket: 69-FBGA |
Lager4.608 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Renesas Electronics America |
IC RSLIC FAMILY 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager3.440 |
|
2-Wire | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68-QFN
|
Paket: 68-VFQFN Exposed Pad |
Lager8.484 |
|
- | - | - | - | - | - | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
Paket: 56-VFQFN Exposed Pad |
Lager5.520 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager6.944 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
BALANCED PBX/KEY SYSTEM SLIC
|
Paket: - |
Request a Quote |
|
2-Wire | 1 | -24V ~ -58V, 4.75V ~ 5.25V | - | - | 0°C ~ 75°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
Paket: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.5mA | 150 mW | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
CML Microcircuits |
IC TELECOM INTERFACE 16SOIC
|
Paket: - |
Lager72 |
|
Parallel | 1 | 2.7V ~ 5.5V | 1.5mA | 800 mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Infineon Technologies |
FLEXISLIC SLIC
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
TQFP 20.00X20.00X1.40 MM, 0.50MM
|
Paket: - |
Request a Quote |
|
JTAG, Serial | 8 | 3.13V ~ 3.47V | 60mA | 1.6 W | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Texas Instruments |
320C6201 352PIN BGA REV3.0 FOR A
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
INFINEON PBM99011/22QS - SSO28-4
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
8P G.FAST 106/4P G.FAST 212
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
DS21Q50 QUAD E1 TRANSCEIVER
|
Paket: - |
Request a Quote |
|
E1 | 4 | 3.135V ~ 3.465V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |