Page 26 - NXP Produkte - PMIC - Leistungsmanagement - spezialisiert

Teilenummer	Hersteller	Beschreibung	Paket	Lager	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MC33FS6507LAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC35FS6507CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC34PF8100CFEPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MWCT1015SFVLL	NXP	WCT1015 100 LQFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Paket: -	Request a Quote	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount	100-LQFP	100-LQFP (14x14)
MWCT1015SFVMH	NXP	WCT1015 100BGA Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	Paket: -	Request a Quote	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount	100-LFBGA	100-MAPBGA (11x11)
MFS2322BMMA0EP	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Request a Quote	-	-	-	-	-	-
MC35FS6505NAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8410G3ESR2	NXP	SYSTEM BASIS CHIP FS8410 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Request a Quote	-	-	-	-	-	-
MFS8630BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Paket: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MC32PF8121EUEPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: Industrial, IoT Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 85°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS4505KAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS4505LAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC35FS6505CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS4505NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS2632AMBA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Paket: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS4505CAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC35FS6506CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8510A0KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS5600AMMA8ESR2	NXP	DUAL 36V AUTOMOTIVE DC-DC CONTRO Applications: - Current - Supply: 140µA Voltage - Supply: 2.7V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Paket: -	Request a Quote	140µA	2.7V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	32-VFQFN Exposed Pad	32-HVQFN (5x5)
MC35FS6515CAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33PF8100CDESR2	NXP	PF8100 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2633AMBA0AD	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Paket: -	Request a Quote	29µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS4506NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC34PF8100F3EP	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC32PF1550A8EPR2	NXP	POWER MANAGEMENT IC 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 4.1V ~ 6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (5x5)	Paket: -	Request a Quote	-	4.1V ~ 6V	-40°C ~ 85°C (TA)	Surface Mount	40-VFQFN Exposed Pad	40-HVQFN (5x5)
MFS8631BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Paket: -	Request a Quote	-	4.5V ~ 36V	-40°C ~ 125°C (TA)	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MC35FS6508NAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Paket: -	Request a Quote	-	1V ~ 5V	-40°C ~ 150°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MVR5510AMBALESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)

MC33FS6507LAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC35FS6507CAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC34PF8100CFEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MWCT1015SFVLL

NXP

WCT1015 100 LQFP

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

Paket: -

Request a Quote

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

MWCT1015SFVMH

NXP

WCT1015 100BGA

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

Paket: -

Request a Quote

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount

100-LFBGA

100-MAPBGA (11x11)

MFS2322BMMA0EP

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Request a Quote

-

MC35FS6505NAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS8410G3ESR2

NXP

SYSTEM BASIS CHIP FS8410

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Request a Quote

-

MFS8630BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

Paket: -

Request a Quote

-

4.5V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-QFN (7x7)

MC32PF8121EUEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: Industrial, IoT
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS4505KAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS4505LAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC35FS6505CAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS4505NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MFS2632AMBA0ADR2

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

Paket: -

Request a Quote

30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33FS4505CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC35FS6506CAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS8510A0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS5600AMMA8ESR2

NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

Applications: -
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

Paket: -

Request a Quote

140µA

2.7V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

32-VFQFN Exposed Pad

32-HVQFN (5x5)

MC35FS6515CAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33PF8100CDESR2

NXP

PF8100

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS2633AMBA0AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

Paket: -

Request a Quote

29µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33FS4506NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC34PF8100F3EP

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC32PF1550A8EPR2

NXP

POWER MANAGEMENT IC 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 4.1V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (5x5)

Paket: -

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-

4.1V ~ 6V

-40°C ~ 85°C (TA)

Surface Mount

40-VFQFN Exposed Pad

40-HVQFN (5x5)

MFS8631BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

Paket: -

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-

4.5V ~ 36V

-40°C ~ 125°C (TA)

Surface Mount

48-VFQFN Exposed Pad

48-QFN (7x7)

MC35FS6508NAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

Paket: -

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-

1V ~ 5V

-40°C ~ 150°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MVR5510AMBALESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: -

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15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)