Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager4.992 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager3.504 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Paket: 56-VFQFN Exposed Pad |
Lager2.128 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager3.088 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Paket: 56-VFQFN Exposed Pad |
Lager4.064 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager4.480 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Paket: 56-VFQFN Exposed Pad |
Lager2.416 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Paket: 56-VFQFN Exposed Pad |
Lager4.544 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Paket: 56-VFQFN Exposed Pad |
Lager5.472 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: - |
Lager2.928 |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC FOR LOW-POWE
|
Paket: 25-UFBGA, WLCSP |
Lager2.704 |
|
- | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 25-UFBGA, WLCSP | 25-WLCSP (2.09x2.09) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager6.300 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Paket: 56-VFQFN Exposed Pad |
Lager7.620 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager8.328 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: - |
Lager6.372 |
|
- | - | - | - | - | - |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager6.348 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager8.088 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC WIRELESS PWR TX 96KB LQFP48
|
Paket: 48-LQFP |
Lager12.612 |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager5.760 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager2.432 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Paket: 56-VFQFN Exposed Pad |
Lager4.096 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager2.496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Paket: 56-VFQFN Exposed Pad |
Lager6.256 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager7.888 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager7.344 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Paket: 56-VFQFN Exposed Pad |
Lager6.496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Paket: - |
Lager4.784 |
|
- | - | - | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Paket: - |
Lager7.936 |
|
- | - | - | - | - | - |