Page 30 - NXP Produkte - PMIC - Leistungsmanagement - spezialisiert

Teilenummer	Hersteller	Beschreibung	Paket	Lager	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MC32PF3001A7EP	NXP	IC PWR MGMT I.MX7 6LDO QFN 48 Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Paket: 48-VFQFN Exposed Pad	Lager12.552	-	2.8 V ~ 5.5 V	-40°C ~ 85°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN (7x7)
MC32PF4210A0ESR2	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: 0°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	Paket: 56-VFQFN Exposed Pad	Lager31.272	-	2.8 V ~ 4.5 V	0°C ~ 85°C (TA)	Surface Mount	56-VFQFN Exposed Pad	56-QFN-EP (8x8)
NX2A4WPZ	NXP	IC WIRELESS PWR RECEIVER Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Lager2.944	-	-	-	-	-	-
NX1WP10Z	NXP	IC WIRELESS PWR RECEIVER WLCSP42 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Lager3.248	-	-	-	-	-	-
NX1A4WPZ	NXP	IC WIRELESS PWR RECEIVER WLCSP42 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Lager7.728	-	-	-	-	-	-
MC34PF1550A0EPR2	NXP	POWER MANAGEMENT IC 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	Paket: 40-VFQFN Exposed Pad	Lager5.136	-	3.8 V ~ 7 V	-40°C ~ 105°C	Surface Mount	40-VFQFN Exposed Pad	40-QFN (5x5)
MC34PF1550A0EP	NXP	POWER MANAGEMENT IC 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	Paket: 40-VFQFN Exposed Pad	Lager5.824	-	3.8 V ~ 7 V	-40°C ~ 105°C	Surface Mount	40-VFQFN Exposed Pad	40-QFN (5x5)
MC32PF1550A0EPR2	NXP	POWER MANAGEMENT IC: 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	Paket: 40-VFQFN Exposed Pad	Lager5.168	-	3.8 V ~ 7 V	-40°C ~ 85°C	Surface Mount	40-VFQFN Exposed Pad	40-QFN (5x5)
MC32PF1550A0EP	NXP	POWER MANAGEMENT IC: 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	Paket: 40-VFQFN Exposed Pad	Lager3.024	-	3.8 V ~ 7 V	-40°C ~ 85°C	Surface Mount	40-VFQFN Exposed Pad	40-QFN (5x5)
MC33PF8200ETES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager6.464	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200ESES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager5.792	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DHES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager4.512	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DFES	NXP	I.MX8QXP WITH DDR3L Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager3.456	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DEES	NXP	IC POWER MANAGEMENT I.MX8QXP Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager7.968	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DBES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager4.672	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200D2ES	NXP	IC POWER MANAGEMENT Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager6.240	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200CXES	NXP	IC POWER MANAGEMENT LS1043A Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager3.504	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33816AE	NXP	IC SOLENOID CTRLR PROGRAMMABLE Applications: Solenoid Controller Current - Supply: - Voltage - Supply: - Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	Paket: 64-LQFP Exposed Pad	Lager2.560	-	-	-40°C ~ 125°C	Surface Mount	64-LQFP Exposed Pad	64-LQFP (10x10)
MC33PF8100ERES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager7.536	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100EQES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager2.960	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100EPES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager6.416	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100EAES	NXP	IC POWER MANAGEMENT LS1046A Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager7.104	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100CHES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager3.872	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100CFES	NXP	IC POWER MANAGEMENT I.MX8QXP Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager5.088	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100CEES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager6.208	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8100CDES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager2.656	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MCZ33800EK	NXP	IC ENGINE CTRL SW/DVR 54-SOIC Applications: Automotive Current - Supply: 10mA Voltage - Supply: 5V ~ 36V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC-EP	Paket: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Lager5.728	10mA	5V ~ 36V	-40°C ~ 125°C	Surface Mount	54-SSOP (0.295", 7.50mm Width) Exposed Pad	54-SOIC-EP
MC34PF8100EREP	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Paket: 56-VFQFN Exposed Pad	Lager5.216	-	2.7V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)

MC32PF3001A7EP

NXP

IC PWR MGMT I.MX7 6LDO QFN 48

Applications: Processor
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

Paket: 48-VFQFN Exposed Pad

Lager12.552

-

2.8 V ~ 5.5 V

-40°C ~ 85°C

Surface Mount

48-VFQFN Exposed Pad

48-QFN (7x7)

MC32PF4210A0ESR2

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: 0°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

Paket: 56-VFQFN Exposed Pad

Lager31.272

-

2.8 V ~ 4.5 V

0°C ~ 85°C (TA)

Surface Mount

56-VFQFN Exposed Pad

56-QFN-EP (8x8)

NX2A4WPZ

NXP

IC WIRELESS PWR RECEIVER

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager2.944

-

NX1WP10Z

NXP

IC WIRELESS PWR RECEIVER WLCSP42

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager3.248

-

NX1A4WPZ

NXP

IC WIRELESS PWR RECEIVER WLCSP42

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager7.728

-

MC34PF1550A0EPR2

NXP

POWER MANAGEMENT IC 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

Paket: 40-VFQFN Exposed Pad

Lager5.136

-

3.8 V ~ 7 V

-40°C ~ 105°C

Surface Mount

40-VFQFN Exposed Pad

40-QFN (5x5)

MC34PF1550A0EP

NXP

POWER MANAGEMENT IC 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

Paket: 40-VFQFN Exposed Pad

Lager5.824

-

3.8 V ~ 7 V

-40°C ~ 105°C

Surface Mount

40-VFQFN Exposed Pad

40-QFN (5x5)

MC32PF1550A0EPR2

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

Paket: 40-VFQFN Exposed Pad

Lager5.168

-

3.8 V ~ 7 V

-40°C ~ 85°C

Surface Mount

40-VFQFN Exposed Pad

40-QFN (5x5)

MC32PF1550A0EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

Paket: 40-VFQFN Exposed Pad

Lager3.024

-

3.8 V ~ 7 V

-40°C ~ 85°C

Surface Mount

40-VFQFN Exposed Pad

40-QFN (5x5)

MC33PF8200ETES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager6.464

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200ESES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager5.792

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DHES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager4.512

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DFES

NXP

I.MX8QXP WITH DDR3L

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager3.456

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DEES

NXP

IC POWER MANAGEMENT I.MX8QXP

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager7.968

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DBES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager4.672

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200D2ES

NXP

IC POWER MANAGEMENT

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager6.240

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200CXES

NXP

IC POWER MANAGEMENT LS1043A

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager3.504

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33816AE

NXP

IC SOLENOID CTRLR PROGRAMMABLE

Applications: Solenoid Controller
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

Paket: 64-LQFP Exposed Pad

Lager2.560

-

-40°C ~ 125°C

Surface Mount

64-LQFP Exposed Pad

64-LQFP (10x10)

MC33PF8100ERES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager7.536

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100EQES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager2.960

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100EPES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager6.416

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100EAES

NXP

IC POWER MANAGEMENT LS1046A

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager7.104

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100CHES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager3.872

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100CFES

NXP

IC POWER MANAGEMENT I.MX8QXP

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager5.088

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100CEES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager6.208

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8100CDES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager2.656

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MCZ33800EK

NXP

IC ENGINE CTRL SW/DVR 54-SOIC

Applications: Automotive
Current - Supply: 10mA
Voltage - Supply: 5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOIC-EP

Paket: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Lager5.728

10mA

5V ~ 36V

-40°C ~ 125°C

Surface Mount

54-SSOP (0.295", 7.50mm Width) Exposed Pad

54-SOIC-EP

MC34PF8100EREP

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

Paket: 56-VFQFN Exposed Pad

Lager5.216

-

2.7V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)