NXP Produkte

MRF6S21140HR5

NXP

FET RF 68V 2.12GHZ NI-880

• Transistor Type: LDMOS
• Frequency: 2.12GHz
• Gain: 15.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 30W
• Voltage - Rated: 68V
• Package / Case: NI-880
• Supplier Device Package: NI-880

Paket: NI-880

2N3906,116

NXP

TRANS PNP 40V 0.2A TO92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 200mA
• Voltage - Collector Emitter Breakdown (Max): 40V
• Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 50nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
• Power - Max: 500mW
• Frequency - Transition: 250MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Paket: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

PDTA123JK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

Paket: TO-236-3, SC-59, SOT-23-3

BAP65-02,115

NXP

DIODE PIN 30V 100MA SOD-523

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 30V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.375pF @ 20V, 1MHz
• Resistance @ If, F: 350 mOhm @ 100mA, 100MHz
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

Paket: SC-79, SOD-523

MC34676BEPR2

NXP

IC BATTERY CHARGER 28V 12UDFN

• Battery Chemistry: Lithium-Ion
• Number of Cells: 1
• Current - Charging: Constant - Programmable
• Programmable Features: -
• Fault Protection: Over Voltage
• Charge Current - Max: 1.2A
• Battery Pack Voltage: 4.2V
• Voltage - Supply (Max): 6.25V
• Interface: USB
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 12-UFDFN Exposed Pad
• Supplier Device Package: 12-UDFN-EP (3x3)

Paket: 12-UFDFN Exposed Pad

TEA1521P/N2,112

NXP

IC CTRLR SMPS OVP UVLO HV 8DIP

• Output Isolation: Isolated
• Internal Switch(s): Yes
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 9.5V
• Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V
• Duty Cycle: 75%
• Frequency - Switching: 10kHz ~ 200kHz
• Power (Watts): 30W
• Fault Protection: Current Limiting, Over Temperature, Short Circuit
• Control Features: Frequency Control
• Operating Temperature: -40°C ~ 145°C (TJ)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP
• Mounting Type: Through Hole

Paket: 8-DIP (0.300", 7.62mm)

74LVT534DB,112

NXP

IC D-TYPE POS TRG SNGL 20SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 4.9ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)

Paket: 20-SSOP (0.209", 5.30mm Width)

74HCT646DB,118

NXP

IC TXRX NON-INV 3-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Paket: 24-SSOP (0.209", 5.30mm Width)

MCZ33905CS3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

PCA9558PW,118

NXP

IC I2C SMBUS 8BIT I/O 28TSSOP

• Applications: PC's, PDA's
• Interface: I2C
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP
• Mounting Type: Surface Mount

Paket: 28-TSSOP (0.173", 4.40mm Width)

MPC8548ECVTAUJB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MPC8264ACVVMIBB

NXP

IC MPU MPC82XX 266MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

Paket: 480-LBGA

MC908GR32AMFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

Paket: 64-QFP

MK20DX256VLK10

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 27x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

Paket: 80-LQFP

TDA8706AM/C3,112

NXP

IC ADC 6BIT W/MUX 24SSOP

• Type: ADC, Video RGB
• Number of Channels: -
• Resolution (Bits): 6 b
• Sampling Rate (Per Second): 40M
• Data Interface: -
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Paket: 24-SSOP (0.209", 5.30mm Width)

AU7555D/01,112

NXP

IC OSC SINGLE TIMER 500KHZ 8SOIC

• Type: 555 Type, Timer/Oscillator (Single)
• Count: -
• Frequency: 500kHz
• Voltage - Supply: 3 V ~ 16 V
• Current - Supply: 180µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

Paket: 8-SOIC (0.154", 3.90mm Width)

SX5100P3KT1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

HTSMOH4801EV,118

NXP

IC HITAG-S 2048BIT MOA2 PLLMC

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 85°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: -

Paket: MOA4, Smart Card Module

BGU8007,115

NXP

IC AMP LNA GPS GLONASS SOT886

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -7dBm
• Gain: 20.5dB
• Noise Figure: 1.1dB
• RF Type: GPS/GNSS
• Voltage - Supply: 1.5 V ~ 2.2 V
• Current - Supply: 11.9mA
• Test Frequency: 1.575GHz
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Paket: 6-XFDFN

MC50XS4200CEK

NXP

IC SWITCH HISD 24V DUAL 32SOIC

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

LS1084AXE7PTA

NXP

LS1084A 1400/1800 XT WE

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

SVF332R3K1CKU2R

NXP

VYBRID R 32-BIT MPU ARM CORTEX-

• Core Processor: ARM® Cortex®-A5 + Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 266MHz, 133MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

Paket: 176-LQFP Exposed Pad

S9S12GA128AMLFR

NXP

12-BIT ADC SPE TST SCREE

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

SAF7751HV-N208W-LK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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S32G274AABK1VUCT

NXP

IC MPU AEC-Q100 1GHZ 525FCPBGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L, LPDDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1/2.5Gbps (4)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

Paket: -

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FS32K116LAT0VFMT

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 17K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 13x12b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Paket: -

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LPC5534JBD100K

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 23x16b; D/A 2x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-HLQFP (14x14)

Paket: -

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SAF7755HV-N207W-SY

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

Request a Quote