Analog Devices will partner with Synopsys to provide the power device model library for Synopsys SaberRD system simulation tools. The addition of ADI's component models, including DC/DC ICS and µModule regulators, provides comprehensive power management modeling for automotive, aerospace and industrial applications.
Mediatek has introduced its first 5G millimeter-wave chip Dimensity 1050, which boasts seamless connectivity, fast display, gaming and power efficiency. By performing 3CC carrier aggregation on the sub-6ghz spectrum and 4CC carrier aggregation on the mmWave spectrum, the Dimensity 1050 is 53% faster than the LTE + mmWave aggregation alone and covers a wider range
Renesas RAA489206 16-cell battery front End (BFE) is an important part of any battery management system, scanning the battery status and operating environment regularly. BFE supports I2C, SPI, and SPI with CRC protocols, enabling customers to connect MCU in a proprietary battery management solution. The device has an internal cell balancing circuit, each cell providing a balanced current of 8mA.
A number of protocols for vehicle diagnostics have been developed over time, but automotive Oems and suppliers have agreed to use unified Diagnostic Services (UDS) as a standard protocol to ensure universal compatibility. Diagnostic protocols are defined in the ISO-14229 standard, which automotive Oems follow to provide a common computer system that can be used to diagnose any vehicle.
The project at hand is an airborne military service intercom with many different signal paths and isolation requirements, all in all, isolation from anything else is better than 100 dB. Signal switching operations are involved, so we need to characterize switch isolation when its signal path should be closed.
E-peas' two power management ics (PMIC) switch automatically between boost, step-boost and step-down operations to maximise energy transfer. The AEM10330 is designed specifically for solar deployment, while the AEM30330 is designed for RF/vibration applications
Chips can be classified in one of two ways, generally based on their function, although sometimes they can be divided into different types based on the integrated circuits used.
Sierra Wireless is now sampling its RF optimized EM92 series 5G NR sub-6 GHz mobile broadband embedded modules. The EM92 family offers 3GPP Release 16 standard functionality and provides high-speed secure connectivity with low latency worldwide.the EM92 module is 30 x 52 x 2.38 mm based on the M.2 dimensions.
Wi-fi standards are also evolving. The standard enables wireless Internet of Things (IoT) devices to operate in the unlicensed 6 GHz spectrum to access more bandwidth. Because many devices already use the 6 GHz band. As a result, Wi-Fi 6E requires new testing to prevent interference.
A new ferroelectric RAM (FRAM) memory chip claims to overcome two major challenges facing space design: radiation and limited power. Infineon Technologies LLC, part of Infineon Technologies AG, which focuses on memory solutions, claims that its new serial interface FRAM has an inherently radiation-resistant memory cell.
Intel continues to support its foundry business while making a concerted effort to get the company back on track to deliver leading-edge silicon processes to fabless customers. Like IC design, EDA and IP industries are integral parts of the IC manufacturing ecosystem; And fabs take the lead.
Many power sources, especially offline ones, require low standby power. For power levels below 100 W, the most cost-effective isolated topology is flyback because it requires the fewest components. Flyback converters typically produce multiple secondary outputs, which require relatively precise tuning. This article describes the challenges of achieving a well-regulated output voltage while still achieving low standby power consumption.
Automotive stakeholders such as OEMs and Tier 1 suppliers must view functional safety (FuSa) as an organization-wide practice. Easier said than done, implementing ISO 26262 compliant FuSa presents its own set of challenges.
With the huge demand for 3840x2160 resolution 4K screens, Display Technology has added two more families to its portfolio -- Plus Line and Eco Line. Plus-line includes the latest uHD displays and a modular display family that can be optimized and adjusted according to user requirements for 24/7 continuous operation.
The Microchip Technology PIC16F171 8-bit microcontroller is a small, feature-rich device that is ideal for low-cost, energy efficient, and high-resolution analog sensor applications. 8- PIN to 20-pin package
Nexperia has partnered with KYOCERA AVX Components to cover GaN power modules for the automotive industry. Provides the two companies with a long-term close relationship and focus on power components with the aim of jointly developing GaN applications for electric vehicles.
Murata partnered with NXP Semiconductors to develop the Type 1XL's extremely high performance Wi-Fi 6 and Bluetooth 5.3 modules. The ultra-small dual-band module is based on NXP 88W9098 Combo core group, and the Wi-Fi part of the module supports connection speed 1.4 times faster than traditional Wi-Fi compatible devices, providing up to 1200Mbps data rate. Module size 19.1mm(l)× 16.5mm(W)× 2.1mm(H)
NevadaNano has announced the results of five consecutive years of operation of the MPS sensor. The sensor was manufactured and calibrated in early 2017 and has been in continuous operation for five years. Is the first low-cost sensor technology to accurately measure a wide range of gases without human intervention. It is also the first sensor technology to measure a wide range of gases with only a change in software
