Infineon has developed a 32-bit programmable microcontroller based on the ARM® Cortex®-M0 core, and the NAC1080 MCU has an NFC interface that can directly control the device through a smartphone. Advanced on-premises and cloud capabilities are extensible in mobile apps provided by regional marketing partners. This helps customers reduce BOM cost and supports miniaturized design of products.
Infineon technologies inc. has introduced efficient and reliable DC-DC buck converter modules to further expand its POL (load power) module lineup. These modules are ideal for system designers who want POL products that are compact, fully integrated, and easy to design to help them speed new products to market.
Infineon Technologies ag and Oxford Ionics announced that they will work together to create a fully integrated high-performance quantum processor (QPU). Oxford Ionics' unique electronic qubit control (EQC) technology, combined with Infineon's global leading engineering, manufacturing capabilities and technical expertise in quantum technology, will lay the foundation for the industrial production of quantum processors with hundreds of qubits within the next five years.
Infineon Technologies and Delta Electronics, two global electronics companies with a long history of innovative semiconductor and power electronics, announced the deepening of their cooperation to enhance the application of wide-band gap SiC and GaN devices in high-end power products to provide outstanding solutions to end customers.
Infineon Technologies AG presents fully programmable motor controllers MOTIX™ IMD700A and IMD701A. Available in a 9 x 9 mm2 64-pin VQFN package, they enable wireless power tools, garden supplies, drones, e-bikes, and automated guided vehicles with higher levels of integration and power density to meet user needs.
Infineon technologies, a global leader in semiconductor solutions, has collaborated with Aqara Greenmi, a leader in whole-house intelligence, to launch a cost-effective and complete smart home human presence solution, namely the Aqara human presence sensor FP1.
Infineon Technologies, a global leader in semiconductor solutions, signed a cooperation agreement with RT-Thread, a well-known IoT operating system manufacturer, and became a gold member of the RT-Thread open source community. Infineon will provide developers in the RT-Thread ecosystem with innovative solutions from products to systems with its technical expertise in core IoT areas such as perception, computing, execution, connectivity, and security.
Infineon Technologies AG has released a new CoolSiC™ technology, the CoolSiC™ MOSFET 1200 V M1H. This advanced silicon carbide (SiC) chip is used in the popular Easy module family, as well as in discrete packages based on .XT interconnect technology, with a very broad product portfolio.
Infineon Technologies inc. has introduced CIPOS Tiny IM323-L6G 600 V 15 A to further expand its LINEUP of CIPOS™ Tiny Intelligent Power Modules (IPM). The new IPM uses TRENCHSTOP™ RC-D2 IGBT power switches and advanced SOI gate drive technology to maximize efficiency and reliability while minimizing the size and cost of the system.
Infineon Technologies AG has partnered with pmd, which specializes in 3D ToF (time-of-flight) systems, to develop the second-generation automotive REAL3™ image sensor, which is ISO26262 compliant and has higher resolution . Housed in a 9 x 9 mm² plastic BGA (Ball Grid Array) package, the sensor achieves a VGA system resolution of 640 x 480 pixels using a tiny photosensitive area of only 4 mm.
To deal with quantum computing will have a significant impact on network security, to ensure the confidentiality of encrypted data and the integrity of digital signatures brought threats. Infineon Technologies inc. has introduced the new OPTIGA™ TPM (Trusted Platform Module) SLB 9672 to further enhance system security. The TPM chip is a forward-looking security solution.
Infineon's AIROC CYW20820 Bluetooth and Low Power Bluetooth ® on-chip systems enable flexible, low power and high performance connectivity
Radar sensors can be used in smart homes and smart health management, ToF sensors can also be used to monitor falls, and carbon dioxide sensors can be used with air conditioners, air purifiers, and other home appliances to detect carbon dioxide concentrations. Infineon is breaking new ground in the new field of smart health management by providing sensors and in-house algorithms, together with partners.
Infineon Technologies AG and 3D ToF system specialist pmdtechnologies AG have jointly developed the second generation of the REAL3 automotive image sensor – a high-resolution 3D image sensor according to the iso26262 standard. The sensor is housed in a 9mm x 9mm² plastic BGA package and offers a VGA system resolution of 640 x 480 pixels and a tiny 4mm image circle. In addition to safety-critical applications, 3D data enables comfort features such as gesture control or intuitive interior lighting to track passenger movements
Infineon Technologies inc. has released the new 1700 V TRENCHSTOP™ IGBT7 module in the EconoDUAL™ 3 standard industrial package. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings to further extend the power range of the inverter. The module can be widely used in wind power, motor drive and static reactive power generator (SVG) applications.
XENSIV™ PAS CO2 sensors can be used in air conditioning systems or air quality monitors for targeted air quality control. This method helps to improve human health and improve work efficiency. Scientific studies have found that indoor carbon dioxide levels as low as 1,000 parts per million (PPM) can make people drowsy and impair concentration.
Infineon Technologies Inc. has introduced the next generation XENSIV MEMS microphone, defining a new industry standard. Microphones are used to capture audio signals with the highest accuracy and quality. The analog microphone IM73A135 delivers the industry's best 73dB(a) SIGNal-to-noise ratio and excellent 135dB SPL AOP. Its digital version, IM72D128, offers 72dB(A) signal-to-noise ratio and 128dB SPL AOP. The IM69D127 offers similar performance in a small 3.6mm x 2.5mm2 package
Infineon's new CAPSENSE solution, integrated into PSoC™ microcontrollers, delivers enhanced performance and lower power consumption for demanding user interfaces such as home appliances, industrial, consumer and Internet of Things products. Enhanced HMI improves detection range, gesture detection and directivity, and adds hover detection for future advanced touch screens, enabling advanced solutions such as proximity sensing.
