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Neue Technologien

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Technology Cover

2018-05-04, Maxim launches Cortex-M4-based MCUs with FPU

Maxim has launched low power MCUs based on the Arm Cortex-M4 with FPU processor which provide designers the means to develop advanced applications under restrictive power constraints.6

Technology Cover

2018-05-04, ST LDO resolves trade-offs

ST’s STLQ020 LDO voltage regulator relieves the familiar trade-offs between quiescent current, output power, dynamic response, and package size, to give designers extra freedom.

Technology Cover

2018-05-04, A modern Bench/System digital multimeter (DMM) - DMM6500

The DMM6500 is ideally suited for design engineers and production test engineers, delivering more measurement functionality, best-in-class measurement insight and a price that will not break the budget.

Technology Cover

2018-05-04, KEMET expands ceramic capacitor series

KEMET has expanded its ESD rated ceramic capacitor series into a complete product portfolio.

Technology Cover

2018-05-04, FlexLogix validates eFPGA cores on TSMC 16nm

The EFLX4K eFPGA FlexLogix IP core, both the Logic and DSP versions, have been fully validated on TSMC16FFC.

Technology Cover

2018-05-04, ON Introduces Image Sensor with Near Infrared Function

ON Semiconductor has introduced a CMOS image sensor using near-infrared+ (NIR+) technology that effectively combines high dynamic range (HDR) with enhanced low-light performance for high-end security and surveillance cameras.

Technology Cover

2018-05-04, Integra Technologies has released GaN-on-SiC Transistors for S-band Radar

Integra Technologies, an RF and microwave transistor and amplifier specialist, has released a pair of 135 W and 130 W GaN-on-SiC transistors for S-band radar applications.

Technology Cover

2018-05-04, Dell and Fujitsu Use Intel FPGAs in Servers

Dell and Fujitsu will use Intel programmable accelerators and Arria 10 GX FPGAs, and Intel Accelerator stacks will use Intel Xeon processors with FPGAs.

Technology Cover

2018-05-04, Phoenix Contact Receives IP40 Protection

Phoenix Contact has introduced the Raspberry Pi mini-computer case that is designed to provide mechanical and physical protection for the Raspberry Pi B2 and B3 models.

Technology Cover

2018-05-04, IoT sensor design can get stable voltage from AA battery

Recom provides a breakout board that connects STMicroelectronics' SensorTile to its R-78S evaluation board.

Technology Cover

2018-05-04, Up to 6A waterproof cable-to-wire connector

Squba is Molex's 1.80 mm pitch sealed wire-to-wire connector system for tight spaces that prevents liquids, dust and dirt.

Technology Cover

2018-05-04, Toshiba-TLP5832-gate-driver

Toshiba's TLP5832 gate drive optocoupler can deliver 2.5A peak output current from the SO8L package, only 2.3mm high and about 50% lower than the company's existing SDIP6 and DIP8 packages.

Technology Cover

2018-05-04, A low-voltage motor driver suitable - STSPIN233

ST's SSTPIN233 is a low-voltage motor driver for single-shunt and three-shunt brushless motor drives and integrates a 200mΩ 1.3Arms power stage in a 3mm x 3mm package.

Technology Cover

2018-05-04, Samsung begins mass production of 10nm 16Gb automotive LPDDR4X DRAM

Samsung begins mass production of 10nm 16Gb automotive LPDDR4X DRAM

Technology Cover

2018-05-04, Würth Elektronik offers tiny step-down DC-DC converter

Würth Elektronik eiSos has expanded its range of power modules with a high power density step-down converter with variable output voltage.

Technology Cover

2018-05-04, Panasonic's Power Choke Coils and Hybrid Capacitors

LP series power chokes and ZE series capacitors (as shown) have high ripple currents (up to 2.0A) and low ESR values.

Technology Cover

2018-05-04, Toshiba launches 256GB USB 3.0 drive

Toshiba has announced a 256GB USB 3.0 flash drive with a maximum read speed of 150MB/s in a retractable form factor.

Technology Cover

2018-05-03, ON Semiconductor - Two controllers and switch device offer quick and easy adoption of USB-C

ON Semiconductor’s latest set of USB-C (Type-C) devices that are fully compliant with the latest revision 1.3 specifications, enabling simple integration into USB-C systems.